INDEX
Explanations
terms related to various properties and functionalities of materials
bonding strength and adhesion
New Auto-Interp
Negative Logits
here
-0.33
gás
-0.32
born
-0.30
organization
-0.29
here
-0.27
graduación
-0.27
herkes
-0.25
urodz
-0.25
urmă
-0.25
born
-0.24
POSITIVE LOGITS
AssemblyCulture
0.88
IntoConstraints
0.75
يتيمه
0.72
BoxFit
0.72
bootstrapcdn
0.71
AsUp
0.68
rungsseite
0.68
WithIOException
0.67
فريبيس
0.67
<<<<<<<<<<<<<<
0.65
Activations Density 0.011%