INDEX
Explanations
technical terms related to materials and processes in semiconductor manufacturing
Fabrication steps: deposition, etching, sputtering
semiconductor deposition and etching
New Auto-Interp
Negative Logits
BoxFit
-0.69
CascadeType
-0.58
TagHelper
-0.57
referenties
-0.56
scho
-0.54
balles
-0.54
protoimpl
-0.54
MessageOf
-0.53
DoubleQuotes
-0.53
AxisAlignment
-0.53
POSITIVE LOGITS
deposition
0.76
deposited
0.75
depositing
0.66
sputtering
0.66
patterned
0.66
film
0.64
etch
0.63
deposit
0.62
resist
0.62
adhesion
0.61
Activations Density 1.261%