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    wire bonding, flip chip, packaging

    np_acts-logits-general · gemini-2.5-flash-lite

    The neuron fires on dense, domain‐specific semiconductor‐fabrication jargon (e.g. “UBM (under bump metallurgy) for flip‐chip interconnections”) rather than ordinary text.

    oai_token-act-pair · o4-miniTriggered by @jyhe0408
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    google/gemma-scope-27b-pt-res/layer_34/width_131k
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    24,576 prompts, 128 tokens each
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    monology/pile-uncopyrighted
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    Negative Logits
    Отзыв
    -0.77
     IMPAC
    -0.75
    Fech
    -0.75
    Spesifikasi
    -0.73
     chronicle
    -0.71
     Recuper
    -0.71
    コンパクト
    -0.71
    Escrito
    -0.71
    Скачать
    -0.71
    ירות
    -0.71
    POSITIVE LOGITS
     packaging
    1.31
    Bond
    1.29
     bonding
    1.26
     bond
    1.24
     Bond
    1.20
    bond
    1.17
     package
    1.16
    package
    1.13
     Flip
    1.13
     Packaging
    1.13
    Activations Density 0.213%

    No Known Activations